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Bando USA, Inc. receives 'Top 10 Brands' Award

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New Portland Warehouse NOW OPEN!

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Rib Ace® Fit belt

  Rib Ace® Fit - Automotive Belt Features: Can be installed on fixed 2-axis pulleys with a specialized tool. Target...

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FlowMetal® Silver Nanoparticle Die-attach Material


  • Pressure-free bonding between metals (Au, Ag, Cu)
  • High bonding strength
  • High electric and thermal conductivities
  • High thermostability and reliability


Development background

Nanoparticles feature low-temperature sintering for improved melting points. Silver nanoparticles make use of Bando’s dispersion technology for pressure-free, low-temperature bonding with high heat-resistance and high reliability.



  • Bonding in power devices requiring high heat resistance and high reliability
  • Lower thermal resistance for power devices and LED
  • Lead-free alternative to high-lead solder
  • Reduced-cost AuSn solder alternative

Download the FlowMetal® Silver Nanoparticle Die-attach Material flier

Please contact Jason Sorce for more information: jason.sorce@bandogrp.com

Contact Us Today If you have questions, comments, need immediate assistance or more information, please don’t hesitate to call Bando USA at (630) 773-6600 or fill out our contact form by clicking the Contact Us Today button.