Specialty Products

Latest News

Company

Honoring Our Veterans - November 2022

AIR FORCE BANDO USA EMPLOYEES Gary Burnett E5 Sergeant 30230 Weather Equipment...

Honoring Our Veterans

AIR FORCE BANDO USA EMPLOYEES Gary Burnett E5 Sergeant 30230 Weather Equipment...

2019 AD Marketplace Supplier of the Year

2019 AD Marketplace Supplier of the Year We are so honored to be awarded the 2019 AD Marketplace Supplier of the Year...
Automotive

AAPEX 2019

Thank you to all of our customers for visiting us at AAPEX this year! We had a wonderful time and we appreciate you coming out...

Rib Ace® Fit belt

  Rib Ace® Fit - Automotive Belt Features: Can be installed on fixed 2-axis pulleys with a specialized tool. Target...
Industrial

2019 AD Marketplace Supplier of the Year

2019 AD Marketplace Supplier of the Year We are so honored to be awarded the 2019 AD Marketplace Supplier of the Year...

2018 IDC-USA Marketplace Award Winner

We are so honored to receive the 2018 IDC-USA Marketplace 'Supplier of the Year' award. It is due to our hard work and...

Toothed Rib Belt

Toothed Rib Belt: The choice for multiple-axis driving. Rubber Chloroprene rubber with excellent durability and wear...
Conveyor

Heat Carry™ Conveyor Belts

Bando’s ultra-high heat and abrasion resistant conveyor belt lineup is specifically designed and compounded to yield...

More News

Select a Category
FlowMetal™

FlowMetal™ is a silver nanoparticle bonding paste with high reliability, which can be sintered at 150゜C without pressure on it.

Features

  • Pressure-free bonding between metals (Au, Ag, Cu)
  • High bonding strength
  • High electric and thermal conductivities
  • High thermo-stability and reliability
  1. Achieves both low bonding temperature and high heat resistance.

    This bonding material uses silver nanoparticles that are capable of low-temperature sintering. With conventional solder and similar materials, it was necessary to use the devices at or below the bonding temperature. However, this bonding material has heat resistance that allows it to be used with no problems even in high-temperature environments that exceed the bonding temperature.

  2. Capable of bonding without pressure

    The same durability and heat resistance as when pressure is applied can now be achieved with pressure-less bonding. Because the pressure application process is not necessary, the manufacturing process can be simplified, helping reduce costs and the number of processes.

  3. Provides both high thermal conductivity and low electrical resistance.

    Achieves both high thermal conductivity and low volume (electrical) resistivity, something that was not possible with previous bonding materials. This supports both electrical conduction and heat dissipation without problems when bonding a power device or other chip that has a high withstand voltage and large current.

 

Development background

Nanoparticles feature low-temperature sintering for improved melting points. Silver nanoparticles make use of Bando’s dispersion technology for pressure-free, low-temperature bonding with high heat resistance and high reliability.

 

Applications

  • For bonding of power devices or other chips with high withstand voltage and large current
  • As a (lower cost) substitute for gold-tin solder when bonding LED, laser diodes, or Peltier elements
  • For bonding of ECU and other automobile components, communication devices, robot controllers, and similar parts

Download the FlowMetal™ flier

Click here for more information: https://www.bandogrp.com/heatsolutions/index_en.html

Please contact Jason Sorce for more information: jason.sorce@bandogrp.com

Contact Us Today If you have questions, comments, need immediate assistance or more information, please don’t hesitate to call Bando USA at (630) 773-6600 or fill out our contact form by clicking the Contact Us Today button.
OK This website uses cookies to provide you with better service.
If you continue to use this website, you are deemed to have consented to the use of cookies.
For more information, see about cookies.